Mathematical and Computational Applications


Mathematical and Computational Applications (ISSN 2297-8747; ISSN 1300-686X for printed edition) is an international open access journal on the applications of the mathematical and/or computational techniques published quarterly online by MDPI from Volume 21 Issue 1 (2016).

  • Open Access - free for readers, with article processing charges (APC) paid by authors or their institutions.
  • High visibility: Indexed in Inspec (IET) and MathSciNet (AMS).
  • Rapid publication: accepted papers are immediately published online.

Mechanics, Materials Science & Engineering Journal

ISSN 2412-5954, e-ISSN 2414-6935

Mechanics, Materials Science & Engineering Journal (ISSN 2412-5954, e-ISSN 2414-6935) is a publisher that deals in peer-reviewed, open access publishing, focusing on wide range of subject areas, including economics, business, social sciences, engineering etc.

MMSE Journal is dedicated to knowledge-based products and services for the academic, scientific, professional, research, and student communities worldwide. Open Access model of online publication promotes research by allowing unrestricted availability of high quality articles. All MMSE publications will be available online, free and full-text.

Impact Factor

ResearchBible based Impact Factor 0.12 (2015).

Benefits for authors
The benefits offered by Mechanics, Materials Science & Engineering Journal to academic, and corporate institutions as well as to readers, authors and editors include:
  • A personalized approach to publishing
  • Open Access to published content
  • Variable licensing agreement options
  • Superior publications under the direction of international experts
  • Traditional print publishing models in addition to electronic journal publishing
  • Archiving of all published issues

To improve the quailty of the published papers MMSE Journal provides obligatory antiplagiarism review by Copyscape.


Full papers for this Special Issue are submitted according to the template of the specific journal. Details about the submission process will be given on site during the Conference.